Shanghai Creative Advanced Materials Co., Ltd. (SCA), situated in the Shanghai Industrial Comprehensive Development Zone, stands as a premier China Silicon Carbide Device Manufacturer & Factory. Our expertise spans the research, development, and high-precision production of semiconductor ceramic targets, powder metallurgy targets, and high-performance ceramic components.
As an industry leader, we integrate a full-lifecycle approach—from raw material synthesis to final component machining. Our mission is to provide the global semiconductor, aerospace, and energy sectors with materials that thrive under extreme conditions of heat, friction, and chemical exposure.
The global shift toward high-efficiency power electronics has placed Silicon Carbide (SiC) at the heart of the "Third Generation Semiconductor" revolution. Unlike traditional Silicon (Si), SiC possesses a wide bandgap (3.26 eV), which allows for breakdown voltages ten times higher than Silicon. As a leading manufacturer, SCA provides the foundational ceramic components and sputtering targets necessary to facilitate this transition.
Boron Carbide (B4C) and Silicon Carbide (SiC) are utilized in individual soldier protection, tank armor, and helicopter shielding due to their extreme hardness and low density.
Our advanced ceramic materials serve as neutron absorption materials, ensuring safety and stability in fission reactor shielding and spent fuel storage.
We supply PVD sputtering targets (W, Mo, Cr, WTi) and ceramic valve components that withstand corrosive plasma environments in cleanroom operations.
We don't just manufacture parts; we solve material science challenges. Our Macro-Industry Solutions address the bottlenecks in modern manufacturing:
High thermal conductivity SiC components for power modules that dissipate heat 3x faster than traditional materials.
Unpressurized Sintered SiC nozzles and valve seats designed for abrasive slurry handling in mining and chemical processing.
Ultra-high purity (99.999%) Tungsten and Molybdenum targets ensuring lattice matching and low defect rates in semiconductor fabrication.
At SCA, our roadmap is defined by three pillars: Miniaturization, Purity, and Performance Stability.
01 Raw Materials: Control of purity, particle size, and chemical stability.
02 Spray Granulation: Monitoring particle size distribution and loose tap density.
03 Cold Pressing: Automated presses ensure blank strength and consistency.
04 Sintering: Hot pressing, pressureless, and reaction sintering methods.
05 Machining: Imported high-precision equipment for micron-level accuracy.
06 Testing: CMM size testing and ceramic performance verification.
07 Cleaning: Dust-free workshops and semiconductor-grade cleaning lines.
08 Logistics: Global export qualifications and reliable logistics partners.
Understanding the complexities of international trade, SCA offers Full Record Traceability from raw materials to final shipment. We comply with major international standards including ISO 9001:2015 and environmental regulations such as RoHS and REACH.
For our global procurement partners, we provide:
Silicon Carbide offers a unique combination of high thermal conductivity (approaching that of metals), excellent thermal shock resistance, and chemical inertness, making it ideal for the plasma-heavy environments inside wafer processing chambers.
We utilize advanced powder metallurgy and vacuum melting processes to control impurity levels. Each target undergoes ICP-MS (Inductively Coupled Plasma Mass Spectrometry) testing to ensure it meets the 4N5 (99.995%) or 5N (99.999%) purity requirements of the semiconductor industry.
Yes, we operate high-precision CNC machining centers that allow us to produce complex geometries—including large-diameter rings up to 600mm and intricate valve components—to within tolerances of +/- 0.005mm.
Beyond its use in armor and neutron absorption, B4C is critical as a grinding material for SiC wafers and solar cells due to its hardness (second only to diamond).
Localized sintering technologies drive upgraded zirconia ceramic industry in China. 2026-07-02
Exploring the future of high-pressure sintering for aerospace grade materials. 2026-06-03
A technical review on how pressureless sintering reduces cost while maintaining SiC performance. 2026-05-22
