Wholesale Alumina target：applied for multiple cutting-edge manufacturing fields Manufacturer, Suppliers

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Wholesale Alumina target：applied for multiple cutting-edge manufacturing fields Manufacturer, Suppliers

Alumina ceramic targets are sputtering targets made from high-purity alumina (Alâ‚‚Oâ‚ƒ, with a purity typically â‰¥99.9%) through powder metallurgy and high-temperature sintering. They are specifically designed for physical vapor deposition (PVD) processes such as magnetron sputtering and pulsed laser deposition. Their exceptional insulating properties, chemical inertness, high hardness, and outstanding optical performance make them critically important in fields such as semiconductor insulation layers, optical coatings, and wear-resistant protection.

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Product Description

Film Properties

High Insulation The prepared alumina film has extremely high resistivity (>10¹⁴ Ω·cm) and dielectric strength (~10 MV/cm), making it an ideal material for insulation and dielectric layers.
High Hardness & Wear Resistance The extremely high hardness of the film (9 on the Mohs scale, second only to diamond) can significantly enhance the scratch and wear resistance of the device surface.
Excellent Chemical Stability Extremely resistant to most acids, alkalis, and solvents, with excellent corrosion resistance and stability at high temperatures.

Sputtering & Film Formation

High Purity & Consistency Ultra-high purity (≥99.9%) and strict composition control ensure stable film performance and avoid electrical or optical defects caused by impurity introduction.
Dense & Uniform Film Formation High target density (≥3.6 g/cm³) and uniform grain size enable high-quality film deposition with low defects and good thickness uniformity (inhomogeneity ≤5%).
Process Stability The ceramic structure is stable, not prone to cracking or powder loss during long-term sputtering, and has a long service life.

Compatibility & Technology

Excellent Thermal Stability The melting point is extremely high (2054°C), and the prepared films can work in high-temperature environments without degradation.
Wide Gas Compatibility Sputtering in inert gas (Ar), reactive gas (O₂), or mixed gas environments with a wide process window.
Good Adhesion Good adhesion to a wide range of substrates (silicon wafers, glass, metals, etc.) and can be used as a functional or protective layer.

Frequently Asked Questions

1. What are the key insulation properties of the prepared alumina film?

The prepared alumina film features exceptionally high resistivity (>10¹⁴ Ω·cm) and a dielectric strength of approximately 10 MV/cm, making it an ideal choice for insulation and dielectric layers.

2. How does the alumina film enhance surface protection?

With a Mohs hardness of 9 (second only to diamond), the film significantly improves the scratch and wear resistance of device surfaces, along with offering excellent corrosion resistance to acids, alkalis, and solvents.

3. What ensures the consistency and quality of the film deposition?

A high target density (≥3.6 g/cm³), ultra-high purity (≥99.9%), and uniform grain size minimize defects and ensure a highly uniform thickness (inhomogeneity ≤5%) during sputtering.

4. Can the alumina film withstand high-temperature environments?

Yes. Because of its extremely high melting point (2054°C), the prepared alumina films can operate stably in high-temperature environments without experiencing degradation.

5. Which process gases are compatible with the sputtering process?

The sputtering process has a wide process window and is highly compatible with inert gas (Ar), reactive gas (O₂), or mixed gas environments.

6. What types of substrates does the alumina film adhere to?

The film demonstrates excellent adhesion to a wide range of substrates, including silicon wafers, glass, and metals, making it versatile for both functional and protective layers.

Product Detail

Wholesale Alumina target：applied for multiple cutting-edge manufacturing fields Manufacturer, Suppliers