Optimized microstructure and ultra-high chemical purity to satisfy demanding semiconductor and PVD coating requirements
Engineered for diffusion barrier layers in microelectronics. Provides exceptional uniformity and minimized particle generation.
Explore WTi Targets
High-density Chromium target suitable for hard protective films, display applications, and optical media layers.
Explore Cr Targets
99.999% ultra-high purity Tungsten sputtering target for gate oxide electrodes and interconnect metallic lines.
Explore W Targets
Designed for low-resistivity gate structures. Delivers superior step coverage and excellent phase composition stability.
Explore WSi TargetsBerlin and the wider Brandenburg metropolitan region stand as one of Germany's most vibrant hubs for advanced technology, research, and precision manufacturing. Key clusters such as the Adlershof Science and Technology Park, along with research institutions like the Max Born Institute, Ferdinand-Braun-Institut (FBH), and Helmholtz-Zentrum Berlin, drive persistent innovation in optoelectronics, PV (photovoltaics), power devices, and microelectronics.
For local fabricators and pilot production lines in Berlin, the sourcing of advanced materials is critical. Powder metallurgy target configurations play a pivotal role here. Whether deposited for thin-film solar devices, sensors, aerospace components, or next-generation semiconductor circuits, the physical properties of the sputtering target directly determine film homogeneity, adhesion, and resistivity. Local enterprises mandate partners who understand German standards (like DIN and ISO norms) and can deliver materials characterized by uniform grain sizes, lack of internal voids, and minimal oxygen content.
Collaborations between Shanghai Creative Advanced Materials Co., Ltd. and academic/industrial partners in Berlin ensure that high-purity targets are customizable to unique specifications. Advanced systems utilizing Physical Vapor Deposition (PVD) rely heavily on targets with consistent density to prevent nodule formation and micro-arcing. By aligning raw material processing with local compliance requirements, we provide Berlin-based developers a reliable gateway to optimize their coating processes.
Producing sputtering targets involves either melting raw materials together or consolidation using powder metallurgy. For refractory alloys, silicides, and ceramic compounds, vacuum melting reaches its physics-based limits. Here is why Powder Metallurgy (PM) has become the gold standard for high-performance sputtering targets:
| Performance Aspect | Powder Metallurgy (PM) Targets | Vacuum Melting (VIM/EBM) Targets |
|---|---|---|
| Grain Size & Distribution | Ultra-fine, isotropic grain structure (typically < 50 µm) with zero orientation preference. | Coarse, column-like grain structures leading to uneven sputtering rates and high particle emission. |
| Chemical Homogeneity | Perfect alloy uniformity at microscopic levels. Crucial for materials like WTi, FeCoTa, and MoTi. | Segregation of phases during cooling, resulting in localized chemical variance on the target surface. |
| Refractory Metals & Ceramics | Ideal for high-melting-point materials (W, Mo, Ta) and complex oxides/carbides. | Extremely difficult or impossible to melt uniformly due to enormous evaporation differences. |
| Target Density | Achieves Relative Density > 99% using Hot Isostatic Pressing (HIP) or Hot Pressing (HP). | May contain micro-shrinkage voids that trigger mechanical failure under high-power sputtering. |
By implementing hot pressing sintering, pressureless sintering, and cold/hot isostatic pressing (CIP/HIP), Shanghai Creative Advanced Materials ensures that each target delivers a highly uniform, low-stress sputtering experience. This decreases system downtime, improves film thickness uniformity across large wafers (such as 300mm formats), and significantly lowers the substrate particle count.
19 Years of Innovation in Advanced Materials & Semiconductor Tooling Components
Established in the prestigious Shanghai Industrial Comprehensive Development Zone, Shanghai Creative Advanced Materials Co., Ltd. is a high-tech company integrating R&D, manufacturing, processing, and sales of high-performance semiconductor ceramic targets, powder metallurgy targets, advanced ceramic materials, polymer materials, and neutron shielding components.
With a focus on providing tailored solutions, we optimize raw materials and sintering methodologies to serve clients in Berlin, wider Europe, and key electronics clusters worldwide. From raw chemical control to automated high-vacuum machining, every single sputtering unit gets a unique serial number, providing full traceability from materials to the final product.
Connect with Our EngineersDedicated commitment to engineering perfection and custom application solutions
Unparalleled commitment to quality control and continuous process improvement. We provide comprehensive GDMS and XRD testing profiles, trace metallic analysis, and ultrasonic bonding evaluations to ensure maximum performance.
We understand that lead times dictate production schedules. By carrying safety stock of high-purity powders and standard backings, we expedite standard target sizes (such as 300mm targets) quickly and safely to Europe.
Our material scientists design and optimize tailored solutions based on target geometry, thermal expansion attributes, and coefficient profiles. We optimize backing plates (copper, molybdenum, or elastomer bonding) for intense sputter yields.
As a leading supplier in the semiconductor and thin-film PVD sector, we support our clients pre- and post-sale. Our team handles cleanroom packaging, custom target dimensions, and spent-target recycling solutions.
Deep-dive analysis of primary ceramic and powder metallurgy compositions
Boron Carbide is one of the hardest artificial materials synthesized, second only to diamond. Characterized by high thermal stability and an extreme neutron absorption cross-section, it is widely utilized for personal ballistic protection, tank armor, nuclear control rods, semiconductor abrasives, and robust thin-film coatings.
Silicon Carbide is an exceptionally hard synthetic crystalline compound. It finds critical application in high-temperature semiconductor processing, wear-resistant structural components, optics, metallurgy, and extreme environmental barriers requiring low thermal expansion and high thermal conductivity.
Alumina is a versatile engineering ceramic known for electrical insulation, high mechanical strength, corrosion resistance, and thermal tolerance. Widely applied in microchip substrates, gas-processing tubes, optical wear coatings, and structural components across aerospace and display engineering.
Boron Nitride features superb chemical resistance and electrical insulation coupled with high thermal conductivity. Commonly referred to as "white graphite," BN serves as lubricating releases, high-voltage isolators, plasma containment components, and heat dissipation materials in space propulsion and power grids.
Comprehensive manufacturing steps ensuring maximum physical reliability
Strict input inspection verifying purity levels, micro-particle size, and chemical consistency of the initial elements.
Controlling uniform slurry composition and spray-drying environments to maximize flowability and pre-forming density.
Automated powder compacting using dry presses and CIP to establish a consistent green-state structural base.
Sintering using Hot Pressing, Pressureless, and HIP technology to maximize density and eliminate interior voids.
High-precision multi-axis grinding and lathe shaping to achieve micron-level dimensions and perfect backing alignment.
Rigorous verification including CMM dimensional checks, density validation, and ultrasonic bonding scan checks.
Semiconductor-grade chemical washing inside cleanrooms to remove volatile traces and organic contaminants.
Vacuum-sealed protective packing and global containerized shipping with dynamic transit tracing.
The deposition rate and film composition control of sputtering targets depend heavily on the target's internal microstructural state. During magnetron sputtering, high-energy argon ions bombard the target, releasing atoms to form a thin film on the substrate.
If the target contains micro-voids, pocket gases, or metallic segregations, high-voltage arcing can happen. Arcing vaporizes small regions of the target, projecting micro-particles onto the wafer, which causes chip failures.
Technical guidance regarding powder metallurgy targets and advanced ceramics
WTi alloy targets made through powder metallurgy avoid the severe phase segregation issues of cast targets. This yields fine-grained, highly homogeneous distribution of W and Ti phases, ensuring uniform thin films and minimized particle contamination during barrier layer deposition.
We source raw chemical powders with certified purity profiles and process them in controlled, dust-free manufacturing areas. The chemical composition is analyzed using GDMS (Glow Discharge Mass Spectrometry), confirming trace metal purities meet 99.99% (4N) to 99.999% (5N) specifications.
Yes. We manufacture circular targets (up to 300mm/12-inch diameters) and custom rectangular targets. We also offer backing plate bonding (using copper, molybdenum, or custom materials) matching standard OEM tool sets.
Standard target configurations ship within 2 to 3 weeks. Custom metallurgical alloys or target designs generally take 4 to 6 weeks, which includes high-vacuum bonding and CMM inspection processes.
For high-hardness coatings, we recommend Cr, MoTi, and Al-Cr targets. These yield dense, wear-resistant nitride and carbonitride layers for cutting tools, automotive components, and aerospace parts.
Explore our extensive range of high-performance materials for optical, microelectronic, and surface engineering applications
High-quality soft magnetic thin-film deposition targets. Optimized for magnetic recording and sensors.
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Ultra-hard boron carbide targets designed for high-performance wear-resistant applications.
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High-density Molybdenum target suitable for solar cell circuits and flat panel electrode layers.
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Chromium Silicon targets designed for thin-film resistor coatings with low temperature coefficient.
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Molybdenum Titanium alloy target optimized for advanced electronic thin-film barriers.
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Provides low-stress, highly uniform silicide layers in integrated circuits.
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Ultra-high-density alumina targets for protective and insulating thin-film layers.
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Zinc Oxide (ZnO) sputtering target engineered for optoelectronic devices and display layers.
View DetailsComplete documentation and references for custom advanced components
Used in UV range optoelectronics and wide-bandgap semiconductor development.
High-strength metallized ceramic interfaces engineered for ultra-high vacuum systems.
Structural components providing superior electrical insulation under high thermal loads.
Zirconia ceramic components built to withstand high chemical wear and thermal shock.
Leveraging 19 years of powder metallurgy development and high-vacuum sintering, Shanghai Creative Advanced Materials Co., Ltd. supplies high-performance thin-film targets engineered to German quality standards.