High-purity sputtering materials tailored for physical vapor deposition and industrial thin-film coatings.
In the modern era of high-precision microelectronics manufacturing, solar energy harvesting, optoelectronics, and advanced surface engineering, Physical Vapor Deposition (PVD) and Chemical Vapor Deposition (CVD) have transitioned from specialized laboratory techniques to critical foundation technologies. The global demand for high-purity sputtering targets and advanced ceramic components is driven by the relentless shrinking of semiconductor nodes and the necessity for robust wear-resistant coatings under extreme conditions.
As semiconductor microstructures push below the 3nm threshold, the requirements for material integrity have reached unprecedented levels. The composition, grain structure, and density of metal target materials (such as high-purity tungsten, molybdenum, titanium, and chromium targets) directly determine the defect rate, thickness uniformity, and electrical performance of deposit barriers, seed layers, and interconnect lines. Concurrently, the growth of deposition applications requires advanced ceramic tooling that can withstand harsh fluorine/chlorine-based plasma environments. Silicon carbide (SiC), alumina ($Al_2O_3$), and boron nitride (BN) have become critical materials in wafer processing chambers, susceptors, nozzles, and electrostatic chucks.
In PVD processes, sputtering targets are subjected to intense ion bombardment. To minimize micro-arcs and particles during deposition, materials must exhibit ultra-high density and isotropic grain alignment. Sub-optimal crystallization or voids within targets lead to uneven ablation, resulting in poor step coverage on wafers.
CVD processes involve high temperatures and highly reactive precursor gases. Tools and structural materials within the reaction chamber must demonstrate extreme thermal shock resistance, chemical inertness, and high dielectric properties. Advanced synthetic ceramics maintain physical structure and resist degradation in these corrosive settings.
19 Years of Innovation in Technical Ceramics and Target Materials
Established in the Shanghai Industrial Comprehensive Development Zone, Shanghai Creative Advanced Materials Co., Ltd. (SCA) is a high-tech pioneer integrating research and development, production, and international sales. We specialize in semiconductor ceramic targets, powder metallurgy targets, advanced ceramic components, and specialized neutron-absorbing materials.
With strong materials engineering capabilities, we supply high-performance solutions designed to meet the rigorous specifications of global semiconductor fabricators and industrial system integrators. By controlling every stage of production from raw powder formulation to final precision machining, we ensure batch-to-batch consistency and traceablity for all products.
Technical ceramics designed for mechanical strength, thermal endurance, and high wear environments.
Extremely hard synthetic material second only to diamond. Widely used for ballistic armor plates, helicopter and tank protection, industrial sandblasting nozzles, and neutron-absorption assemblies in nuclear reactors.
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High-purity reaction-bonded or pressureless sintered SiC provides excellent thermal conductivity, low thermal expansion, and extreme erosion resistance, making it perfect for semiconductor susceptors and valves.
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High purity structural alumina features excellent electrical insulation, chemical resistance, and wear proofing. Excellent for semiconductor processing chambers, handling arms, and plasma shielding components.
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Often referred to as white graphite, BN offers high thermal shock resistance, easy machinability, high dielectric breakdown, and chemical inertness for high-temperature nozzles and crucibles.
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Strict controls over chemical purity, crystalline phase, and particle size distribution ensure stability from the onset.
Slurry concentrations and uniform binder distributions are monitored to produce spherical, free-flowing granules.
Automated isostatic presses consolidate powder blanks, achieving consistent green density before firing.
Various thermal methods including hot-pressing, reaction, and pressureless sintering to eliminate residual pores.
Precision CNC grinding machines refine ceramic targets to tight dimensional tolerances, preventing warp during use.
CMM dimensional testing, density validation, and ultrasound detection guarantee zero structural cracks.
Class-100 dust-free workshops and chemical washes remove organic contaminants and particle residues.
Vacuum packaging and robust wooden crating guarantee safe delivery to cleanrooms worldwide.
The constant demand for higher computing power requires semiconductor devices to employ materials with superior thermal profiles and high purity levels. PVD/CVD targets act as the source material for the critical metallic and compound barrier layers within integrated circuits.
Modern semiconductor fabrication lines operate on 300mm wafer diameters. Standard targets are prone to deformation under magnetic sputtering forces due to internal mechanical stress. SCA’s tungsten ($W$), tungsten-titanium ($WTi$), and chromium ($Cr$) targets are engineered via advanced powder metallurgy. Our hot-press systems apply pressure uniformly during thermal bonding to achieve target relative density values exceeding 99.5%, preventing sputtering instabilities and gas trapping.
In silicon etching chambers, components are exposed to high fluorine gas temperatures and reactive RF power. Standard quartz or alumina components degrade quickly. Ultra-high purity reaction-bonded and pressureless-sintered Silicon Carbide ($SiC$) parts exhibit superior thermal conductivity (up to 200 W/mK) and low coefficients of thermal expansion. These components reduce particle shedding, ensuring stable yields over long production campaigns.
Beyond thin-film microelectronics, boron-rich compounds such as high-purity Boron Carbide ($B_4C$) function as crucial neutron-shielding materials. Harnessing the exceptionally high neutron-capture cross-section of the boron-10 isotope, SCA manufactures custom sintered ceramic sheets and blocks tailored for high-radiation enclosures, shielding containers, and nuclear fuel assembly components.
Why key industry players trust SCA for critical ceramic and target applications.
We provide full physical traceability from raw powder to finished component. Every unit carries a unique serial number tied to its metallurgical test records, ensuring consistency across batch runs.
We operate optimized manufacturing and post-processing schedules to fulfill critical orders promptly, maintaining inventory levels for key microchip fabrications.
Our engineering team designs custom structural profiles and alloy targets. We analyze physical strain, heat dissipation, and plasma density to deliver optimized performance.
We offer comprehensive technical support from material selection through integration. Our team is available to assist with diagnostic inquiries, configuration adjustments, and target replacement optimization.
High-purity target compositions and precision machined structural ceramics for industrial integration.
Answers to common engineering and procurement questions regarding high-purity PVD/CVD materials.
Catch up with the latest material science breakthroughs, local target innovations, and industrial applications.
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Continuous research in high-temperature vacuum sintering methods yields targets with density profiles exceeding 99.5% relative density.
An exploration of pressureless sintering for SiC components in sub-10nm chip manufacturing equipment.