As the global semiconductor industry pivots toward sub-7nm logic processes and advanced 3D NAND flash memory, the demand for Ultra-High Purity (UHP) sputtering targets has reached an all-time high. China, once a follower in material science, has emerged as a dominant global hub for high-performance Physical Vapor Deposition (PVD) materials.
Information Gain: We integrate vertical supply chain control from raw ore purification to final 300mm target bonding.
Established in the Shanghai Industrial Comprehensive Development Zone, our facility is at the heart of the "Silicon Shield" supply chain. With 19 years of industry experience, we specialize in high-tech research and development, bridging the gap between raw powder metallurgy and the rigorous demands of wafer fabrication.
Our commitment to E-E-A-T (Experience, Expertise, Authoritativeness, Trustworthiness) ensures that every target delivered meets the stringent Yield Management requirements of modern fabs.
Satisfied Global Customers
Sputtering targets are the "ammunition" of the thin-film deposition process. Our solutions cater to a broad spectrum of localized and global applications:
Tungsten (W) and Tungsten-Titanium (WTi) targets for diffusion barriers and contact layers in 12-inch wafer processing.
Magnesium Zinc Oxide and Alumina targets for high-brightness LEDs and UV sensors.
High-purity Silicon Carbide and Chromium targets for Thin-film solar cell electrodes.
The industry is rapidly shifting from 200mm to 300mm fabs. We have scaled our production of 300mm W, WSi, and Cr targets to meet this high-volume manufacturing (HVM) trend.
Modern nodes require near-zero defectivity. Our automated cleaning lines and ISO-4 dust-free packaging ensure minimal particle generation during sputtering.
Custom MoSi and WTi alloy targets are becoming critical for specific etching resistance and work function tuning in FinFET transistors.
Sustainable sourcing and material recycling are now procurement mandates. Shanghai Creative implements green powder metallurgy processes.
Ensuring reliability through every stage of the manufacturing cycle.
Control of purity, particle size, and chemical composition stability to ensure foundational quality.
Monitoring slurry concentration and composition uniformity for optimal powder distribution.
Automated presses form the blank, providing superior strength and geometric consistency.
Utilizing hot pressing, pressureless, and reaction sintering for high-density material outputs.
Known as the "Black Diamond," B₄C is critical for neutron absorption in nuclear industries and as a superior grinding material in semiconductor wafer thinning.
Expert Analysis →A synthetic crystalline compound used for precision ceramic components that require extreme wear and corrosion resistance in plasma etching chambers.
Material Datasheet →Used for its high-temperature insulation and heat dissipation properties, often found in rocket nozzles and high-pressure electronic components.
Technical Specs →
Localized sintering technologies drive upgraded zirconia ceramic industry in China, reducing dependency on imported kiln designs.
Exploring the molecular bonds of Silicon Carbide and its impact on the thermal stability of wafer carriers.
Why pressureless sintering is becoming the preferred method for complex geometry ceramic components in the LED sector.
