As a leading China Ceramic Tape Welding Manufacturer, Shanghai Creative Advanced Materials Co., Ltd. is at the forefront of a materials revolution. Ceramic tape welding—often integrated with tape casting (Doctor Blade process)—is the critical technology used to create multi-layered ceramic structures. These structures are the backbone of high-power semiconductor modules, solid oxide fuel cells (SOFCs), and sophisticated microelectronic packages.
In the current global industrial landscape, the demand for "smaller, faster, and more thermally efficient" components has moved Ceramic Tape Welding from a niche process to a macro-industrial necessity. By laminating ultra-thin ceramic sheets—such as Alumina (Al₂O₃), Silicon Nitride (Si₃N₄), or Aluminum Nitride (AlN)—and welding them through high-temperature sintering or diffusion bonding, we achieve dielectric properties and thermal management capabilities that traditional metallurgy cannot match.
The global advanced ceramics market is projected to grow significantly, driven by the Electric Vehicle (EV) surge and the 5G infrastructure rollout. In the EV sector, Si₃N₄ ceramic substrates produced via tape welding provide the thermal shock resistance necessary for silicon carbide (SiC) power inverters. Our expertise as a supplier ensures that these components withstand the rigorous thermal cycling of modern automotive environments.
Established in the Shanghai Industrial Comprehensive Development Zone, we are a high-tech company that integrates the research and development, production, and sales of semiconductor ceramic targets, powder metallurgy targets, and ceramic components. Our focus spans advanced ceramic materials, polymer products, and neutron absorption materials.
With 19 years of experience, our commitment to quality orientation and continuous improvement enables us to be the preferred partner for innovative, ready-to-run solutions. We provide full record traceability from raw materials to final products, with unique serial numbers for every unit produced.
Utilizing Boron Carbide (B₄C), Silicon Carbide (SiC), and Boron Nitride (BN) to develop materials with hardness second only to diamond. These are used in individual soldier protection, armored vehicles, and nuclear industries as neutron absorbers.
Specialized solutions for AMB (Active Metal Brazing) and DBC (Direct Bonded Copper) substrates. Our ceramic tape welding processes ensure zero-void bonding, which is essential for the reliability of IGBT modules in high-speed rail and wind energy.
High-temperature, high-pressure insulation components and rocket engine nozzles utilizing our advanced Sintered Plate & Crucibles. Our materials provide the chemical corrosion resistance needed in extreme inorganic acid environments.
Providing high-purity 300mm W, WSi, and Cr targets. These are critical for the thin-film deposition phase in sub-7nm logic and memory chip fabrication, ensuring enhanced performance and yield.
Purity and particle size stability monitoring for ultimate material consistency.
Monitoring slurry concentration and loose tap density for powder uniformity.
Automated pressing for high-strength blanks and structural consistency.
Hot pressing, pressureless, and reaction sintering methods available.
Imported high-precision equipment for micron-level component accuracy.
CMM size testing, ceramic performance, and powder performance validation.
Dust-free workshop and semiconductor-grade cleaning production lines.
Qualified export partners ensuring safe global delivery of sensitive materials.
A: Ceramic tape welding (tape casting) allows for much thinner layers (down to 10 microns) and the ability to create complex internal channels and multi-material laminates. Dry pressing is limited to bulk shapes and cannot easily achieve the multilayer density required for modern electronics.
A: Aluminum Nitride (AlN) is the gold standard due to its high thermal conductivity (170-230 W/m·K), which is significantly higher than Alumina (Al₂O₃). We supply both materials to meet different cost and performance requirements.
A: Our targets, such as WTi and Cr, undergo rigorous ultrasonic non-destructive testing (NDT) to ensure zero internal defects and are refined to 99.999% (5N) purity to prevent chip contamination during PVD processes.
A: Yes, we specialize in Europium oxide and Gadolinium oxide neutron absorbing cores. These materials are manufactured with high precision to meet strict nuclear safety and absorption cross-section specifications.
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