Ultra-high density targets manufactured via advanced powder metallurgy techniques to meet cleanroom standards of advanced wafer processing lines.
Ideal for diffusion barrier layers in advanced silicon wafer integration.
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Delivering superior adhesion performance and high thermal stability coatings.
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Controlled grain sizes engineered to limit particle generation during PVD deposition.
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Homogeneous phase distribution for consistent electrical resistance control.
Explore SpecsSingapore remains a central powerhouse in the global semiconductor footprint, contributing to approximately 10% of the world’s microchips and 20% of global semiconductor manufacturing equipment. Advanced wafer fabs operated by multinationals in cluster regions like Woodlands, Tampines, and Pasir Ris demand ultra-high specifications for materials consumed in physical vapor deposition (PVD) processes.
For sub-micron lithography and high-density integration nodes, target uniformity is key. Modern memory and logic processes require advanced barrier coatings to stop copper diffusion while sustaining high conductivity. Standard vacuum melting techniques fail to process refractory metal systems and complex silicides with uniform microstructures.
Shanghai Creative Advanced Materials Co., Ltd. addresses this segment by fabricating specialized powder metallurgy targets. These alloys, including MoSi, WSi, MoTi, and CrSi, are structured to perform optimally within standard tool setups like Applied Materials (AMAT) Endura, Evatec, and Anelva platforms.
For composite alloys like W-Ti (Tungsten-Titanium) or Mo-Ti (Molybdenum-Titanium), casting is often impractical due to the massive discrepancy in melting points (Tungsten melts at 3422°C; Titanium melts at 1668°C). Attempting to melt these components results in severe gravity segregation and phase non-uniformity.
PM ensures grain sizes remain consistently under 100 micrometers, which yields a highly uniform sputtering rate across the wafer diameter.
Utilizing Hot Isostatic Pressing (HIP) and vacuum hot pressing achieves relative densities exceeding 99%, suppressing gas voids and micro-pores.
Solid-state diffusion maintains targeted phase ratios (e.g., 90% W / 10% Ti wt%), preventing local stoichiometry drift on the substrate.
When sputtered, targets engineered via PM yield thin films with highly uniform sheet resistance (Rs), crucial for microelectronic gate electrode applications. Homogeneous distribution also translates to a lower rate of target nodule formation, increasing overall target life and drastically reducing chamber cleaning downtime for production lines.
In the semiconductor supply chain, reliability is as important as purity. Shanghai Creative Advanced Materials Co., Ltd. operates a high-capacity manufacturing base in the Shanghai Industrial Comprehensive Development Zone. Leveraging Industry 4.0 automation, we ensure seamless production from raw materials synthesis to final ultra-high vacuum cleaning and packaging.
Our facility integrates advanced diagnostic testing, including GDMS (Glow Discharge Mass Spectrometry) to evaluate trace elements up to 99.999% purity. High-resolution C-scan ultrasonic testing confirms bonding integrity between targets and copper or elastomer backing plates.
Shanghai Creative Advanced Materials Co., Ltd., established in the Shanghai Industrial Comprehensive Development Zone, is a pioneering high-tech enterprise. Our core capabilities integrate research and development, volume manufacturing, and sales of semiconductor ceramic targets, powder metallurgy targets, advanced ceramic components, and specialized neutron-absorbing shielding materials.
We focus on supplying custom-tailored material formulations matching unique properties of advanced materials to fulfill the requirements of high-vacuum thin film systems globally. Our focus on quality and innovation has made us a trusted supplier for major technological hubs across Asia, Europe, and North America.
Unparalleled commitment to quality, continuous improvement, and full records traceability from raw materials to final sputtering units. Patented solutions guarantee zero risk.
Optimized logistics systems ensure that orders are processed quickly. JIT capability maintains supply chain integrity for overseas accounts.
Tailored solutions for sputtering targets and high-performance engineering ceramics, fitting tools of all mainstream brands and configurations.
Comprehensive design support, material consultancy, backing plate design, and recycling systems for precious metal sputtering residue.
SCA supports wafer fabrication and physical vapor deposition systems with diverse material configurations.
Extreme hardness second only to diamond. Essential for target backing setups, protective armors, and semiconductor grinding components.
Synthetic crystalline structure ideal for wafer handles, lithography stages, solar processing elements, and thermal systems.
Exhibits exceptional electrical insulation and plasma erosion resistance. Applied in etch chambers and structural parts.
Maintains thermal shock resistance and high-temperature dielectric strength. Extensively applied in crucibles and insulators.
How SCA ensures consistent grain size, high density, and near-zero impurity levels.
Rigorous testing of particle sizes, purity, and gas impurities before blending ensures zero chemical variance.
Advanced atomization process yields highly uniform, spherical granules which optimize powder flowability and fill densities.
Applying omnidirectional high pressure to consolidate target bodies, creating green bodies with high pre-sinter strength.
Vacuum sintering, reaction sintering, or hot pressing paths to maximize mechanical density and remove internal voids.
Automated high-precision CNC lathes deliver target planar surfaces and exact alignment tolerances without surface contamination.
Applying coordinate measuring machine (CMM) analysis and ultrasonic scanning of bonding layers to find micro-delamination.
Cleanroom chemistry wash removes residual hydrocarbons, followed by multi-layer vacuum bagging with desiccants.
Robust transit cases protect targets during export, preserving their high-vacuum integrity until installation.
Common queries from process engineers and procurement professionals in Singapore.
Preserved original specifications. Directly sourcing high-grade metal composites and ceramics for global advanced technology manufacturing.
Targeted for thin-film magnetic storage media and sensor applications.
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Superhard compound coatings for protective and tribological thin films.
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High density targets for thin-film solar and flat panel display layers.
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Optimal for precision thin-film resistors with low temperature coefficients.
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Designed for high-reliability barrier films in thin film solar panels.
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Providing excellent oxide layer passivations at elevated process temperatures.
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Premium purity targets for optical layers and thin film insulators.
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Targeted transparency and structural characteristics for active layers.
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