Top-tier components for mission-critical environments.
As nodes shrink to 3nm and beyond, the demand for high-purity Silicon Carbide (SiC) and Silicon Nitride (Si3N4) components is skyrocketing. Our factory provides the thermal stability and chemical inertness required for plasma etching and CVD processes.
Boron Carbide (B4C) is essential for neutron absorption in nuclear reactors. In the solar sector, our ceramic targets enable the efficient deposition of thin-film coatings, driving up PV conversion rates.
The global advanced ceramics market is projected to reach $150 billion by 2030. Shanghai Creative Advanced Materials Co., Ltd is positioned at the heart of this supply chain, bridging the gap between raw powder metallurgy and high-precision finished components.
Established in the Shanghai Industrial Comprehensive Development Zone, we are a high-tech company integrating research, development, production, and sales. We specialize in semiconductor ceramic targets, powder metallurgy targets, and advanced ceramic components.
Our commitment to material science has led to breakthroughs in neutron absorption materials and high-performance polymer products, serving a global clientele seeking reliability and performance.
Years of Experience
Core Technologies
Professionals
Satisfied Customers
Developing 99.99999% purity levels for sub-atomic research and next-gen microprocessor manufacturing.
Combining Pressureless Sintering (PLS) with Isostatic Pressing (HIP) to achieve zero-porosity structures in structural ceramics.
Integrating 3D printing techniques to create complex internal geometries for cooling channels in rocket nozzles and thermal exchangers.
Compliance Assurance: Every product from our factory meets international standards including ISO 9001 and RoHS. For defense and nuclear applications, we provide full record traceability from raw powder batching to final CMM verification.
Local Support: We have established a robust logistics network with global partners to ensure door-to-door delivery with customs clearance support, minimizing lead times for critical maintenance and manufacturing cycles.
Purity, particle size, and chemical composition stability control.
Slurry concentration monitoring and particle size distribution.
Automated press for blank forming with superior consistency.
Hot pressing, pressureless, and reaction sintering methods.
High-precision imported equipment for micron-level accuracy.
CMM size testing, ceramic performance, and powder analysis.
Semiconductor-grade clean production line and dust-free packaging.
Expert export qualifications and secure packaging for transit.
Our SiC powder undergoes secondary purification and precise grain sizing, ensuring minimal metallic impurities which prevents wafer contamination during the manufacturing process.
Yes, our 300mm Cr, W, and alloy targets are engineered to specific thickness and backing plate requirements, compatible with mainstream PVD systems.
Standard orders typically range from 4-6 weeks, though we maintain a strategic stock of raw materials to expedite emergency defense and industrial requests.
We use customized shock-absorbent packaging and vacuum sealing. Every shipment is insured and tracked through our logistics partners with export-compliant documentation.
