China Iron Cobalt Tantalum Target Supplier & Factory

Global leader in advanced sputtering targets, high-purity powder metallurgy alloys, and precision ceramic solutions optimized for next-generation semiconductor fabrication, data storage media, and magnetic shielding.

Premium Advanced Sputtering Materials

Explore our range of precision-manufactured targets, slugs, and components engineered for optical coatings, semiconductors, and functional industrial designs.

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Understanding Iron Cobalt Tantalum (FeCoTa) Sputtering Targets

Iron Cobalt Tantalum alloy (FeCoTa) sputtering targets are the cornerstone materials for the fabrication of soft magnetic underlayers (SUL) and advanced magnetic recordings. By incorporating precise trace amounts of Tantalum into the Iron-Cobalt binary matrix, the alloy forms an amorphous structural phase that dramatically minimizes grain-boundary noise while ensuring optimal magnetic permeability, low coercivity, and high saturation magnetization.

At Shanghai Creative Advanced Materials Co., Ltd., we utilize advanced powder metallurgy and vacuum melting processes to eliminate localized segregation. Our FeCoTa targets feature a homogeneous distribution, ultra-low gas content (O, N, H < 100ppm), and exceptional density exceeding 98% of the theoretical limit. This level of quality guarantees structural stability during RF, DC, or magnetron sputtering processes.

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Advanced Sputtering Target Microstructure

China Factory & Supply Chain Superiority

Why Tier-1 semiconductor developers and global corporations trust our vertically integrated manufacturing ecosystem.

Vertically Integrated Supply Chain

Vertically Integrated Raw Materials

By securing primary high-purity Fe, Co, and Ta metal powders locally within China, we protect customers from international market volatility, offering stable pricing and reliable delivery lead times.

Advanced Powder Metallurgy

Advanced Manufacturing Methods

Our facility features state-of-the-art Hot Isostatic Pressing (HIP) and Vacuum Induction Melting (VIM) systems. These technologies prevent elemental segregation in multi-component thin-film applications.

Strict Compliance & Testing

Global Compliance & Verification

Every target undergoes strict inspection, including GDMS purity analysis and ultrasonic non-destructive testing (NDT), to guarantee zero bonding voids and stable sputtering performance.

SCA Production Facility
19 Years of Advanced Material Innovation

About Shanghai Creative Advanced Materials

Shanghai Creative Advanced Materials Co., Ltd. (SCA), situated in the Shanghai Industrial Comprehensive Development Zone, is a high-tech pioneer integrating R&D, production, and sales of high-purity sputtering targets, advanced structural ceramics, and powder metallurgy products.

Over nearly two decades, we have partnered with domestic and international semiconductor fabs, data storage giants, and scientific research institutes. We offer customized product series tailored to meet demanding deposition parameters.

19+
Years R&D
100+
Patents
200+
Professionals
5000+
Clients

Engineered Material Solutions

Delivering high-quality performance through strict design and material refinement.

Top Quality Quality Assurance

Top Quality

We provide complete trace history from raw powders to finished targets. Serialized tracking guarantees consistent quality, batch after batch.

Fast Delivery Shipping

Fast Delivery

With optimized manufacturing paths and inventory programs, we minimize production delays and ship quickly worldwide.

Professional Design Custom Solutions

Professional Design

We engineer targets customized to your specific geometry, backing plate configurations, and multi-component compositions.

Perfect Services Support

Perfect Services

SCA offers end-to-end support, including technical consulting, target bonding service, and spent-target recycling programs.

Innovative Advanced Ceramic Materials

We supply high-performance ceramic materials and functional targets tailored for industrial applications.

Boron Carbide Ceramic
Ultra Hardness

Boron Carbide (B₄C)

One of the hardest synthesized materials. Essential for personal armor, nuclear neutron-absorption shielding, and semiconductor grinding media.

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Silicon Carbide Ceramic
Thermal Stability

Silicon Carbide (SiC)

Offers high hardness, thermal shock resistance, and corrosion resistance. Widely used for precision processing components in the LED and semiconductor sectors.

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Alumina Target
Dielectric Insulation

Alumina (Al₂O₃)

Excellent electrical insulation and wear resistance, suited for high-temperature structural designs and thin-film passivation processes.

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Boron Nitride Ceramic
High Temperature

Boron Nitride (BN)

Combines high thermal conductivity and corrosion resistance. Often applied as electrical insulation panels and evaporation crucibles.

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Production Flow Control

A step-by-step overview of our quality assurance pipeline, ensuring consistent high-purity sputtering performance.

01

Raw Materials

We verify trace element purity, grain-size distribution, and chemical stability from the start.

02

Spray Granulation

Ensures uniform slurry distribution, preventing localized variances in multi-component targets.

03

Cold Pressing

Automated hydraulic compression creates uniform density in green bodies.

04

Sintering

Vacuum hot-pressing and pressureless sintering options yield high densities.

05

Machining

Precision CNC tooling shapes targets to exact dimensions with tight tolerances.

06

Testing

CMM measurements, ultrasonic bond line testing, and GDMS analyze impurity limits.

07

Cleaning

Cleanroom chemical washing removes handling residue and surface contaminants.

08

Logistics

Vacuum-sealed packaging protects targets from humidity and oxidation during transit.

Global Procurement Needs

Modern semiconductor and recording thin-film processes require high yield rates. Sputtering targets must exhibit uniform composition and high density to reduce particulate ejection (nodule formation) during operation. Our customized backing plates and indium bonding services meet the mechanical standards of major industry sputtering systems.

Local Integration & Compliance

We operate in compliance with ISO 9001 and ISO 14001, providing RoHS, REACH, and full conflict-free mineral trace certifications. Our logistics team handles international export clearances and custom duty packaging, helping clients maintain secure supply chains.

Future Material Trends

As magnetic storage density reaches physical limits, HAMR (Heat-Assisted Magnetic Recording) systems demand complex FeCoTa, FePt-based, and co-sputtered ceramic-dopant targets. We continue to invest in microstructural refinement to support these next-generation thin-film designs.

Industrial Application Scenarios

Where our advanced materials play critical roles in high-tech manufacturing.

1. Hard Disk Drives (HDD)

Used in magnetic thin-film heads and soft magnetic underlayers (SUL) to guide magnetic flux writing, enabling high recording densities.

2. MRAM Fabrication

Provides high spin polarization and magnetic anisotropy, key to layering magnetic tunnel junctions (MTJ) in memory devices.

3. Electromagnetic Shielding

Sputtered thin films shield sensitive electronic components from EMI, especially in compact high-frequency devices.

Technical Q&A / Frequently Asked Questions

Common technical inquiries regarding procurement, target composition, and processing parameters.

What typical atomic compositions of FeCoTa targets are available?
Our standard composition is customized to customer requirements, such as Fe88Co8Ta4 (at%) or FeCoTa alloys with varying dopant levels. We control the elemental ratio within ±0.5% deviation via vacuum powder metallurgy.
How does Tantalum improve target sputtering performance?
Tantalum helps create an amorphous phase in the deposited film, refining the grain structure. This lowers grain boundary noise and maintains structural stability at the high temperatures used in magnetic storage manufacturing.
What is your typical target bonding method?
We offer high-purity Indium (In) metal bonding to Oxygen-Free Copper (OFC) backing plates, achieving bonding coverage rates exceeding 98% (verified by ultrasonic scans) to prevent cracking or thermal failure.
What are the lead times for custom orders?
Depending on target geometry and complexity, custom powder preparation and hot isostatic pressing typically take 4 to 6 weeks. Standard configurations may be fulfilled faster.

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