Ultra-pure metal and alloy sputtering targets manufactured via precision cold isostatic pressing and advanced sintering methodologies.
As the capital of Aichi Prefecture, Nagoya is globally recognized as the epicenter of Japan's automotive, aerospace, and precision manufacturing hubs. The region has transitioned rapidly from heavy industrial machinery to advanced microelectronics, robotics, and clean-energy technologies. At the heart of this shift lies the demand for thin-film technologies produced by Physical Vapor Deposition (PVD) processes. Sputtering targets manufactured via powder metallurgy serve as the critical medium for depositing thin barrier films, optical coatings, and semiconductor electrical layers.
Local electronics manufacturers and research institutes around the Chubu region demand highly specialized material behaviors. Typical cast targets fail to provide the grain refinement and compositional uniformity required by Nagoya's leading semiconductor equipment and sensor firms. Through advanced powder metallurgy, we eliminate macroscopic segregation and suppress micro-cracking during deep high-power sputtering. This ensures a consistent, high-yield deposition rate essential for automotive micro-sensors, thin-film power circuits, and high-temperature protective coatings.
Traditional target production cannot achieve the extreme density levels needed to eliminate particulate generation (arcing) during thin-film deposition. Shanghai Creative Advanced Materials Co., Ltd. (SCA) implements proprietary gas-pressure sintering, hot pressing, and vacuum hot-pressing techniques to produce sputtering targets. This process achieves a relative density exceeding 99% and maintains grain size within a narrow micrometer range, extending the operational lifespan of target plates under rigorous production cycles in industrial fabs.
Our operation bridges the gap between global supply chain optimization and local logistical responsiveness. Nagoya’s industrial philosophy relies heavily on Just-In-Time (JIT) manufacturing and zero-defect quality management. Through our local partnerships and logistics channels, we offer comprehensive backing plate assembly, target refurbishment, and customized configuration designs tailored specifically to standard Japanese deposition tools (such as ULVAC, Canon Anelva, and Applied Materials systems).
From raw chemical elements to target-backing plate assemblies, our production steps ensure absolute reliability for critical environments.
We rigorously inspect chemical purity, particle size distribution, and crystalline phase ratios. This ensures consistent source material before processing.
Uniform distribution of composite powders is achieved under inert gas atmosphere. This steps prevents agglomeration and external atmospheric contamination.
Applying uniform multidirectional pressure yields green compacts with isotropic density, minimizing spatial distortion during subsequent sintering.
Vacuum hot-pressing, pressureless sintering, or HIP processes are utilized to attain ultra-high densities and control grain expansion rates.
CNC grinding and wire EDM systems shape target configurations, maintaining tolerances within micrometers to prevent vacuum leakage in PVD systems.
We verify flatnesses, diameters, and physical characteristics using Coordinate Measuring Machines alongside ultrasonic flaw detection.
Multi-stage chemical solvent and deionized water baths remove manufacturing residue, preventing trace element outgassing in high-vacuum tools.
Target products are sealed under vacuum in multi-layered polymer bags inside Class 100 cleanrooms to preserve pristine surface chemistry.
Beyond metal targets, we engineer next-generation ceramic components and structural compounds with outstanding thermal and mechanical limits.
Known as "artificial diamond," Boron Carbide features extreme hardness, second only to diamond and cubic boron nitride. Ideal for lightweight ceramic armors, abrasive materials, and as neutron-absorbing rods within pressurized water reactors (PWR).
Demonstrating robust chemical durability, zero structural fatigue at elevated temperatures, and thermal shock resistance. Highly demanded in Nagoya's semiconductor wafer handling components, pump seals, and gas turbine nozzles.
The baseline structural advanced ceramic offering excellent electrical isolation, wear resistance, and cost competitiveness. Commonly used as substrates, protective rings, and plasma insulation shield panels in semiconductor tooling.
A broad array of metal, compound, and alloy targets optimized for magnetron sputtering systems.
Get professional answers regarding powder metallurgy processes, target selection, and thin-film performance variables.
Connect with our technical engineers to discuss material configurations, customized geometries, and pricing structures optimized for your specific deposition systems.
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