Industry-leading purity and density for next-generation manufacturing.
Shanghai Creative Advanced Materials Co., Ltd. (SCA) is a high-tech powerhouse established in the Shanghai Industrial Comprehensive Development Zone. With over 19 years of dedicated research and production experience, we specialize in semiconductor ceramic targets, powder metallurgy targets, and neutron absorption materials. Our core expertise lies in the integration of R&D, advanced manufacturing, and global supply chains to support the most demanding technological environments.
Years Experience
Core Technologies
R&D Professionals
Global Customers
The global demand for Tungsten Silicide (WSi) sputtering targets is surging, driven by the expansion of 5G, IoT, and AI computing. Tier-1 semiconductor foundries in Taiwan, South Korea, and the USA require 300mm WSi targets with ultra-low oxygen content (<500ppm) and high density (>98% theoretical) to minimize particulate generation during PVD processes.
WSi targets are pivotal in modern CMOS fabrication. Our technical team provides tailored solutions for poly-silicide gate structures, high-temperature stable interconnects, and Schottky barrier diodes. By controlling the Silicide-to-Tungsten ratio, we help manufacturers achieve the perfect balance between thermal stability and electrical conductivity.
The industry roadmap is moving toward thinner films and smaller nodes (7nm and below). Future WSi targets must exhibit grain sizes under 100μm and uniform phase distribution (tetragonal WSi2). Shanghai Creative is currently developing Nano-crystalline WSi targets to further reduce "arcing" and improve deposition rates.
WSi (Tungsten Silicide) has become the material of choice for "polycide" (polysilicon-silicide) gates because of its exceptional thermal stability during post-deposition annealing. Unlike other metal silicides, WSi maintains its integrity at temperatures up to 1000°C, making it indispensable for high-performance processors and DRAM fabrication. As a WSi target manufacturer, we understand that the commercial value lies in Information Gain—not just the product, but the application data that ensures your fabrication yields stay high.
Beyond WSi: Our full portfolio of ceramic and metallurgy solutions.
Second only to diamond in hardness. Ideal for individual soldier protection, tank armor, and neutron absorption in nuclear reactors.
Explore B4C seriesSynthetic crystalline compound for precision ceramic components in semiconductor, solar, and high-performance LED fields.
Explore SiC seriesExcellent chemical resistance and heat dissipation. Used in rocket engine nozzles and high-pressure insulation parts.
Explore BN series
High-purity tungsten target 300mm
Tungsten titanium alloy target 300mm
Reliable 300mm WSi Target for Performance
High-Purity 300mm Cr Target
From raw powders to high-precision thin films.
Strict control over purity, particle size, and chemical stability.
Monitoring slurry concentration and particle distribution.
Automated pressing for blank consistency and strength.
Hot pressing, pressureless, and reaction sintering methods.
Imported high-precision equipment for target accuracy.
CMM size testing and ceramic performance verification.
Semiconductor cleaning line and dust-free packaging.
Global export qualifications and reliable shipping partners.
As the semiconductor industry advances toward the Angstrom era, the requirements for WSi targets are evolving. Shanghai Creative is investing heavily in Hot Isostatic Pressing (HIP) technology to eliminate micro-pores, ensuring that the next generation of WSi targets provides zero-defect deposition for 2nm and 3nm nodes.
We provide localized technical support for global clients, including on-site PVD troubleshooting and customized target backing plate bonding (Indium bonding). All products are fully compliant with ISO 9001, RoHS, and REACH standards, ensuring seamless integration into any international supply chain.
We typically supply WSi targets at 4N (99.99%) to 5N (99.999%) purity, specifically targeting low levels of alkali metals (Na, K < 100ppb) and radioactive elements (U, Th < 1ppb) for semiconductor gate applications.
Yes, while WSi2 is the most common, we can manufacture targets with custom stoichiometry (WSix) ranging from x=2.0 to x=3.0 to meet specific film stress and resistivity requirements.
WSi is inherently brittle. We utilize a proprietary vacuum hot-pressing technique that produces a fine, equiaxed grain structure, which significantly improves thermal shock resistance. We also recommend and provide Indium bonding to copper backing plates for better heat dissipation.
For standard 200mm and 300mm targets, our lead time is typically 4-6 weeks. Wholesale orders benefit from our prioritized production line to ensure fast delivery for mass production fab requirements.
Trusted solutions for critical environments.
