In the high-stakes world of semiconductor manufacturing and thin-film deposition, the Molybdenum-Titanium (MoTi) alloy target has emerged as a critical component. As global demand for higher processing speeds and more durable flexible displays grows, MoTi alloys serve as the indispensable diffusion barrier and adhesion layer.
Our MoTi alloy targets are engineered with ultra-high purity (up to 99.99%) to ensure minimal contamination during the sputtering process. By meticulously controlling the Mo-Ti ratio—typically 50/50 or custom blends—we provide a material that exhibits excellent thermal stability and matched coefficients of thermal expansion (CTE) with silicon and glass substrates. This synergy prevents delamination and ensures long-term reliability in high-heat environments.
Operating from the Shanghai Industrial Comprehensive Development Zone, we leverage China's world-class metallurgical infrastructure. Our vertical integration—from raw material purification to final CNC machining—allows us to offer wholesale pricing without compromising on the precision required by Tier-1 tech manufacturers. We bridge the gap between "cost-efficiency" and "extreme performance" through 19 years of iterative R&D.
We provide full documentation including REACH, RoHS, and ISO 9001:2015 certifications. Every shipment comes with a Certificate of Analysis (COA) and GDMS testing reports to ensure compliance with European and American high-tech standards.
Understanding that downtime is costly, we offer localized technical consulting. Our engineers assist with target bonding, backing plate selection, and sputtering parameter optimization to maximize "Target Utilization Rate" and minimize film defects.
The industry is shifting toward 300mm (12-inch) wafer processes and 8K resolution displays. Our MoTi targets are already optimized for large-format sputtering, providing high density and uniform grain size to support the next generation of microelectronics.
Our 8-step manufacturing process ensures every MoTi target meets the highest industry benchmarks.
Controlling purity, particle size, and chemical composition stability from the source.
Using automated presses to form blanks with superior strength and consistency.
Utilizing hot pressing, pressureless, and isostatic pressing sintering methods.
Imported high-precision equipment to ensure exact dimensional accuracy.
CMM size testing, ceramic performance testing, and GDMS purity analysis.
MoTi alloys provide significantly better adhesion to glass and polymer substrates. The addition of Titanium improves the corrosion resistance of the film and helps in forming a more stable diffusion barrier in thin-film transistor (TFT) applications.
Yes, while Mo-Ti 50/50wt% is the industry standard, our factory can customize the ratio (e.g., MoTi 60/40 or 70/30) to meet specific work function or etch rate requirements of your production line.
As a certified exporter, we handle all logistics paperwork. We use vacuum-sealed, moisture-proof packaging and reinforced wooden crates to ensure targets arrive without oxidation or structural damage, regardless of the destination.
For standard sizes, lead time is usually 2-3 weeks. Custom geometries or ultra-high purity requirements may take 4-6 weeks depending on our current sintering schedule.
Established in the Shanghai Industrial Comprehensive Development Zone, we are a high-tech company integrating R&D, production, and sales. We specialize in semiconductor ceramic targets, powder metallurgy targets, and neutron absorption materials. Our 19-year legacy is built on providing ready-to-run solutions for the most demanding global applications.
