Industry-leading sputtering targets and ceramic components for precision thin-film deposition.
FeCoTa (Iron-Cobalt-Tantalum) sputtering targets represent a pinnacle of metallurgical engineering in the semiconductor industry. As the world transitions toward Magnetoresistive Random-Access Memory (MRAM) and ultra-sensitive magnetic sensors, the demand for high-purity, stoichiometric-consistent FeCoTa thin films has reached an all-time high.
At Shanghai Creative Advanced Materials (SCA), we leverage our 19 years of expertise to manufacture FeCoTa targets with an amorphous structure. The addition of Tantalum (Ta) serves a dual purpose: it acts as a grain refiner to achieve a smooth, defect-free film morphology and serves as a diffusion barrier that stabilizes the magnetic properties of the Iron-Cobalt (FeCo) matrix during high-temperature annealing processes.
How FeCoTa targets are shaping the future of data storage and sensing technology.
FeCoTa is critical for the "Free Layer" and "Pinned Layer" in MTJs (Magnetic Tunnel Junctions). Our targets ensure low switching current density and high thermal stability, essential for high-performance non-volatile memory chips.
Utilized in GMR (Giant Magnetoresistance) and TMR (Tunnel Magnetoresistance) sensors for steering angle, speed, and current sensing in electric vehicles (EVs), where high reliability under extreme temperatures is mandatory.
In the global hard disk drive industry, FeCoTa films are used to concentrate magnetic flux in the write pole, enabling higher areal density for cloud storage and enterprise servers.
Operating out of the Shanghai Industrial Comprehensive Development Zone, SCA provides a unique strategic advantage for global buyers. Our integration of domestic high-purity raw material sourcing with advanced Hot Isostatic Pressing (HIP) and vacuum melting technologies ensures a robust supply chain that is resistant to global fluctuations.
Years Experience
Core Patents
Professionals
Global Clients
Our 8-step precision manufacturing process ensures every FeCoTa target meets semiconductor-grade requirements.
Rigid control over purity (>99.95%) and chemical composition stability.
Monitoring particle size distribution and loose tap density of the alloy powder.
Automated pressing to form the initial blank with high density and consistency.
Hot pressing and pressureless options to achieve theoretical density.
Imported high-precision equipment ensures tolerances within ±0.05mm.
CMM size testing, ICP-OES for purity, and XRD for phase analysis.
Dust-free workshop packaging and ultrasonic cleaning lines.
Secure vacuum packaging with global export qualifications.
Anticipating the needs of the 2nm node and beyond.
Focus on reducing oxygen content to <200ppm to improve magnetic permeability and reduce noise in thin films.
Developing monolithic 12-inch targets for high-volume semiconductor fabs, ensuring uniform sputtering across large wafers.
Researching Boron-doped (FeCoTaB) variants to enhance the amorphous nature and improve MTJ reliability for high-temperature automotive applications.
Established as a high-tech company integrating R&D, production, and sales, we specialize in semiconductor ceramic targets, powder metallurgy targets, and neutron absorption materials. Our commitment to quality orientation and continuous improvement enables us to be the premier partner for innovative material solutions.
We provide full record traceability. Serial numbers are assigned to every single unit, ensuring that our customers in the aerospace, semiconductor, and nuclear industries receive only the highest standard of product.
Technical answers for procurement and engineering teams.
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