High-purity metallurgy and ceramic solutions for global industries
In the rapidly evolving landscape of Very-Large-Scale Integration (VLSI) and microelectronics, the Tungsten Titanium (WTi) sputtering target has emerged as an indispensable material. Primarily utilized as a diffusion barrier and adhesion layer, WTi targets facilitate the seamless integration of aluminum or copper interconnects with silicon substrates, preventing detrimental interdiffusion at high temperatures.
As a leading China Tungsten Titanium target manufacturer, Shanghai Creative Advanced Materials Co., Ltd (SCA) leverages 19 years of metallurgical expertise to deliver targets that meet the stringent 5N (99.999%) purity requirements of the global 300mm wafer industry. Our commitment to Information Gain means we don't just provide material; we provide the thermal stability and low-resistivity data required for high-yield semiconductor fabrication.
The global demand for high-purity WTi targets is projected to grow by 7.4% CAGR through 2030, driven by the surge in 5G infrastructure, AI processing chips, and the transition to 12-inch wafer manufacturing hubs in Asia and Europe.
Shanghai Creative Advanced Materials Co., Ltd: Your Trusted Partner in Advanced Ceramics & Metallurgy
Based in the Shanghai Industrial Comprehensive Development Zone, SCA integrates R&D, production, and sales to offer high-tech solutions in semiconductor ceramic targets, powder metallurgy, and neutron absorption materials.
China's dominance in the Tungsten Titanium target sector is not merely about cost. It is about Supply Chain Vertical Integration. By sourcing raw tungsten and titanium locally, we reduce lead times and ensure chemical consistency.
| Property | SCA Standard | Industry Avg |
|---|---|---|
| Purity | 99.999% (5N) | 99.99% (4N) |
| Relative Density | > 99.5% | ~ 98% |
| Grain Size | < 100 μm | ~ 150 μm |
| Deflection | < 0.1mm | ~ 0.3mm |
From Logic Chips to Aerospace, WTi Targets are the silent enablers of technology
WTi serves as the barrier layer between the silicon substrate and the metal interconnect (Al, Cu, Au), preventing "spiking" and ensuring long-term device reliability.
In TFT-LCD and OLED manufacturing, WTi targets are used for gate electrodes and wiring due to their excellent adhesion and corrosion resistance.
Advanced thin-film solar cells utilize WTi layers to enhance carrier collection efficiency and provide a robust moisture barrier.
The industry is moving toward "Target Recycling" and "Green Metallurgy." SCA is pioneering low-waste powder metallurgy processes that reduce raw material consumption by 15% without compromising purity.
As fabs transition to 12-inch wafers, the demand for large-format monolithic WTi targets has skyrocketed. We have optimized our large-scale sintering equipment to provide targets with zero internal voids at 300mm+ diameters.
When selecting a China WTi target supplier, global procurement teams must audit:
Stringent quality management for zero-defect manufacturing
Control purity, particle size, and chemical composition stability.
Control slurry concentration and monitor particle size distribution.
Using automated presses for superior blank strength and consistency.
Hot pressing, pressureless, and reaction sintering methods available.
Imported high-precision equipment to ensure micron-level accuracy.
Equipped with CMM, ceramic performance, and powder testing labs.
Class 100 dust-free workshop for semiconductor-grade packaging.
Global export qualifications with reliable logistics partners.
Expert insights into Tungsten Titanium target procurement and application
The most common ratio is W-Ti 10wt% (90% Tungsten, 10% Titanium). This ratio provides the optimal balance between diffusion barrier effectiveness and chemical etching properties during subsequent chip processing.
We use electronic-grade powders and perform multiple rounds of vacuum refining. Every batch is tested using Glow Discharge Mass Spectrometry (GDMS) to ensure metallic impurities remain below 10ppm.
Yes. We offer professional Indium bonding services for all our targets, using oxygen-free copper (OFC) or molybdenum backplates to ensure optimal heat dissipation during the sputtering process.
Standard lead times for custom semiconductor-grade targets are 4-6 weeks. Our factory efficiency allows us to expedite urgent orders for R&D phases within 3 weeks.
High-performance materials for advanced industrial applications
SCA — Empowering Global Semiconductor Excellence Through Material Innovation.
